replica watches fake watches

Home    |    Model Comparison    |     Inquiry    |     Contact Us    |   Site Map      |     

                                                                                                                           Main Product:RF Module

Online Contacts
RF System-in-Package & RF Module Design

The trend in the wireless industry toward smaller form factor and more functionality has been driving technology innovations for continued increase in functional density and a decrease in the cost per function. SiP, SoP, and 3DIC technologies are rapidly evolving from a specialty technology used in a narrow set of applications, to a high volume technology that addresses current market and design challenges. However the complex design problems with mixed signal, mixed mode, multi-technology, increased interconnect density and closer design proximity has also increased design challenges to meet design requirements faster and at a lower cost.


RF System-in-Package Design

Agilent EEsof EDA is the market and technology leader in RF SiP & RF Module design solutions offering:

  • The best methodologies for designing SiPs with high confidence
  • The best RF SiP co-design platform
  • And the best way to reduce design failure risks due to unpredicted parasitics